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1

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Assessment on palladium-coated copper wire bonding for 28nm Cu/low-k chips: Al bond pad and NiPd bond pad

Wai, Leong Ching, Mariyappan, Dhayalan, Koh, Chee Guan, Chai, Tai Chong

Année:

2015

Langue:

english

Fichier:

PDF, 1.32 MB

english, 2015

2

[IEEE 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2016.5.31-2016.6.3)] 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) - Development of High Density Fan Out Wafer Level Package (HD FOWLP) with Multi-layer Fine Pitch RDL for Mobile Applications

Rao, Vempati Srinivasa, Chong, Chai Tai, Ho, David, Zhi, Ding Mian, Choong, Chong Ser, PS, Sharon Lim, Ismael, Daniel, Liang, Ye Yong

Année:

2016

Langue:

english

Fichier:

PDF, 2.23 MB

english, 2016

3

Failure Mode and Mechanism Analysis for Cu Wire Bond on Cu/Low-k Chip by Wire Pull Test and Finite Element Analysis

Che, Fa Xing, Wai, Leong Ching, Chai, Tai Chong

Journal:

IEEE Transactions on Device and Materials Reliability

Année:

2018

Langue:

english

Fichier:

PDF, 945 KB

english, 2018

4

Feasibility study of the application of voltage contrast to printed circuit board

Cher Ming Tan, Zhenghao Gan, Tai Chong Chai

Journal:

Microelectronics Reliability

Année:

2006

Langue:

english

Fichier:

PDF, 750 KB

english, 2006

5

Development of Large Die Fine-Pitch Cu/Low- FCBGA Package With Through Silicon via (TSV) Interposer

Tai Chong Chai, Xiaowu Zhang, Lau, J.H., Selvanayagam, C.S., Damaruganath, P., Hoe, Y.Y.G., Yue Ying Ong, Rao, V.S., Wai, E., Hong Yu Li, Liao, E.B., Ranganathan, N., Vaidyanathan, K., Shiguo Liu, Jia

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2011

Langue:

english

Fichier:

PDF, 1.12 MB

english, 2011

6

150-$\mu{\rm m}$ Pitch Cu/Low-${\rm k}$ Flip Chip Packaging With Polymer Encapsulated Dicing Line (PEDL) and Cu Column Interconnects

Seung Wook Yoon,, Thew, S.M.L., Lim, S.Y.L., Wai Yin Hnin,, Tai Chong Chai,, Viswanath, A.G.K., Kripesh, V.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2008

Langue:

english

Fichier:

PDF, 1.45 MB

english, 2008

7

Thermo-mechanical finite element analysis in a multichip build up substrate based package design

Xiaowu Zhang, E.H. Wong, Charles Lee, Tai-Chong Chai, Yiyi Ma, Poi-Siong Teo, D. Pinjala, Srinivasamurthy Sampath

Journal:

Microelectronics Reliability

Année:

2004

Langue:

english

Fichier:

PDF, 833 KB

english, 2004

8

Non-destructive identification of open circuit in wiring on organic substrate with high wiring density covered with solder resist

Cher Ming Tan, Kim Peng Lim, Tai Chong Chai, Guat Cheng Lim

Journal:

Microelectronics Reliability

Année:

2005

Langue:

english

Fichier:

PDF, 461 KB

english, 2005

9

The mechanics of the solder ball shear test and the effect of shear rate

Julian Yan Hon Chia, Brian Cotterell, Tai Chong Chai

Journal:

Materials Science and Engineering: A

Année:

2006

Langue:

english

Fichier:

PDF, 1.72 MB

english, 2006

10

Reliability of Wire Bonding on Low-k Dielectric Material in Damascene Copper Integrated Circuits PBGA Assembly

Mohandass Sivakumar, Vaidyanathan Kripesh, Chong Ser Choong, Chai Tai Chong, Loon Aik Lim

Journal:

Microelectronics Reliability

Année:

2002

Fichier:

PDF, 1.72 MB

2002

11

Finite element modeling of capacitive coupling voltage contrast

Cher Ming Tan, Stanny Yanuar, Tai Chong Chai

Journal:

Microelectronics Reliability

Année:

2007

Langue:

english

Fichier:

PDF, 1.14 MB

english, 2007

12

Study on the Effect of Wafer Back Grinding Process on Nanomechanical Behavior of Multilayered Low-k Stack

Sekhar, V.N., Lu Shen, Kumar, A., Tai Chong Chai, Xiaowu Zhang, Premchandran, C.S., Kripesh, V., Seung Wook Yoon, Lau, J.H.

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2012

Langue:

english

Fichier:

PDF, 3.46 MB

english, 2012

13

Modular sensor chip design for package stress evaluation and reliability characterisation

A.D. Trigg, Tai Chong Chai, Xiaowu Zhang, Xian Tong Chen, Leong Ching Wai

Journal:

Microelectronics Reliability

Année:

2012

Langue:

english

Fichier:

PDF, 1.60 MB

english, 2012

14

[IEEE 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2010.06.1-2010.06.4)] 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) - Design and fabrication of a reliability test chip for 3D-TSV

Trigg, A D, Yu, Li Hong, Zhang, Xiaowu, Chong, Chai Tai, Kuo, Cheng Cheng, Khan, Navas, Daquan, Yu

Année:

2010

Langue:

english

Fichier:

PDF, 752 KB

english, 2010

15

In Situ Measurement and Stress Evaluation for Wire Bonding Using Embedded Piezoresistive Stress Sensors

Yong, Woon Yik, Zhang, Xiaowu, Chai, Tai Chong, Trigg, Alastair, Jaafar, Norhanani Binte, Lo, Guo-Qiang

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2013

Langue:

english

Fichier:

PDF, 2.38 MB

english, 2013

16

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Fine pitch Cu pillar wafer process development and seed layer etching characterization

Li Yan Siow,, Wei Deng,, Qing Xin Zhang,, Tai Chong Chai,, Chee Guan Koh,, Witarsa, D., Xianfeng Wang,, Hongqi Sun,, Ando, T., Tong Yan Tee,, Wong, J.

Année:

2012

Langue:

english

Fichier:

PDF, 1.29 MB

english, 2012

17

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Copper wire bond reliability evaluation using a modular test chip

Trigg, A. D., Chai Tai Chong,, Fen, S. Y. P., Kwee, J. L. T., Ming, C. C. H., Mung, S. C. S., Ping, C., Ganesh, V. P., Low, B., Chu, T. L., Leng, E. P.

Année:

2012

Langue:

english

Fichier:

PDF, 5.62 MB

english, 2012

18

[IEEE 1995 Proceedings. 45th Electronic Components and Technology Conference - Las Vegas, NV, USA (21-24 May 1995)] 1995 Proceedings. 45th Electronic Components and Technology Conference - Investigation on the effect of copper leadframe oxidation on package delamination

Chai Tai Chong,, Leslie, A., Lim Thiam Beng,, Lee, C.

Année:

1995

Langue:

english

Fichier:

PDF, 1.19 MB

english, 1995

19

Heterogeneous Three-Layer TSV Chip Stacking Assembly With Moldable Underfill

Pei-Siang, Sharon Lim, Che, Fa Xing, Choong, Chong Ser, Rong, Michelle Chew Bi, Sekhar, Vasarla Nagendra, Rao, Vempati Srinivasa, Chong, Chai Tai

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2013

Langue:

english

Fichier:

PDF, 3.09 MB

english, 2013

20

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Assembly and reliability of micro-bumped chips with Through-silicon Vias (TSV) interposer

Ong, Yue Ying, Chai, Tai Chong, Yu, Daquan, Thew, Meei Leng, Myo, Eipa, Wai, Leong Ching, Jong, Ming Chinq, Rao, Vempati Srinivasa, Su, Nandar, Zhang, Xiaowu, Damaruganath, Pinjala

Année:

2009

Langue:

english

Fichier:

PDF, 1.91 MB

english, 2009

21

Comprehensive Study on the Interactions of Multiple Die Shift Mechanisms During Wafer Level Molding of Multichip-Embedded Wafer Level Packages

Ling, Ho Siow, Lin, Bu, Choong, Chong Ser, Velez, Sorono Dexter, Chong, Chai Tai, Zhang, Xiaowu

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2014

Langue:

english

Fichier:

PDF, 3.01 MB

english, 2014

22

3-D Numerical and Experimental Investigations on Compression Molding in Multichip Embedded Wafer Level Packaging

Ji, Lin, Sorono, Dexter Velez, Chai, Tai Chong, Zhang, Xiaowu

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2013

Langue:

english

Fichier:

PDF, 1.36 MB

english, 2013

23

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Reliability study on through mold via (TMV) for 3D microelectronic packaging under thermal and moisture loadings

Chen, Zhaohui, Chong, Ser Choong, Zheng, Boyu, Jung, Boo Yang, Chai, Tai Chong, Zhang, Xiaowu

Année:

2013

Langue:

english

Fichier:

PDF, 543 KB

english, 2013

24

Reliability of a Silicon Stacked Module for 3-D SiP Microsystem

Seung Wook Yoon,, Lim, S.Y.L., Viswanath, A.G.K., Thew, S., Tai Chong Chai,, Kripesh, V.

Journal:

IEEE Transactions on Advanced Packaging

Année:

2008

Langue:

english

Fichier:

PDF, 1.37 MB

english, 2008

25

Failure Mechanism for Fine Pitch Microbump in Cu/Sn/Cu System During Current Stressing

Hsiang-Yao Hsiao,, Trigg, Alastair David, Tai Chong Chai,

Journal:

IEEE Transactions on Components Packaging and Manufacturing Technology

Année:

2015

Langue:

english

Fichier:

PDF, 1.54 MB

english, 2015

26

[IEEE 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Singapore (2015.12.2-2015.12.4)] 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC) - Process and challenges of ultra-thick spin-on photoresist

Ho, Soon Wee, Sek, Soon Ann, Lau, Boon Long, Rao, Vempati Srinivasa, Chai, Tai Chong

Année:

2015

Langue:

english

Fichier:

PDF, 637 KB

english, 2015

27

[IEEE 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2017.12.6-2017.12.9)] 2017 IEEE 19th Electronics Packaging Technology Conference (EPTC) - Characterization of molding compound material and dielectric layer of RDL

Zihao, Chen, Guan, Lim Teck, Wee, David Ho Soon, Chong, Chai Tai, Bhattacharya, Surya

Année:

2017

Fichier:

PDF, 682 KB

2017

28

[IEEE 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2017.5.30-2017.6.2)] 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) - Process and Reliability of Large Fan-Out Wafer Level Package Based Package-on-Package

Rao, Vempati Srinivasa, Chong, Chai Tai, Ho, David, Zhi, Ding Mian, Choong, Chong Ser, PS, Sharon Lim, Ismael, Daniel, Liang, Ye Yong

Année:

2017

Langue:

english

Fichier:

PDF, 2.40 MB

english, 2017

29

[IEEE 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2019.5.28-2019.5.31)] 2019 IEEE 69th Electronic Components and Technology Conference (ECTC) - Ultra-Thin FO Package-on-Package for Mobile Application

Hsiao, Hsiang-Yao, Ho, Soon Wee, Lim, Simon Siak Boon, Wai, Leong Ching, Chong, Ser Choong, Sharon Lim, Pei Siang, Han, Yong, Chai, Tai Chong

Année:

2019

Langue:

english

Fichier:

PDF, 944 KB

english, 2019

30

[IEEE 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2019.12.4-2019.12.6)] 2019 IEEE 21st Electronics Packaging Technology Conference (EPTC) - High Density RDL build-up on FO-WLP using RDL-first Approach

Ho, Soon Wee, Hsiang-Yao, Hsiao, Lim, Simon Siak Boon, Choong, Chong Ser, Siang, Sharon Lim Pei, Chong, Chai Tai

Année:

2019

Langue:

english

Fichier:

PDF, 366 KB

english, 2019

31

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Demonstration of Vertically Integrated POP using FOWLP Approach

Chong, Ser Choong, Wai Leong Ching, Eva, Pei Siang, Sharon Lim, Lim Siak Boon, Simon, Chai, Tai Chong

Année:

2020

Fichier:

PDF, 769 KB

2020

32

[IEEE 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2020.6.3-2020.6.30)] 2020 IEEE 70th Electronic Components and Technology Conference (ECTC) - Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package

Chong, Chai Tai, Teck Guan, Lim, Yong, Han, Che, F. X., Ho Soon Wee, David, Chong, Ser Choong

Année:

2020

Fichier:

PDF, 834 KB

2020

33

[IEEE 2011 IEEE 13th Electronics Packaging Technology Conference - (EPTC 2011) - Singapore, Singapore (2011.12.7-2011.12.9)] 2011 IEEE 13th Electronics Packaging Technology Conference - Fine pitch copper wire bonding process optimization with 33µm size ball bond

Jaafar, Norhanani Binte, Wai Leong Ching,, Rao, Vempati Srinivasa, Chai Tai Chong,, Trigg, Alastair David, Kanchet, Guna, Sivakumar,

Année:

2011

Langue:

english

Fichier:

PDF, 1.04 MB

english, 2011

34

[IEEE 4th Electronics Packaging Technology Conference (EPTC 2002) - Singapore (10-12 Dec. 2002)] 4th Electronics Packaging Technology Conference, 2002. - Low cost materials and processes for OE packaging

Ong Chu Kuen,, Krishnamachari, S., Ramana, P., Chai Tai Chong,

Année:

2002

Langue:

english

Fichier:

PDF, 560 KB

english, 2002

35

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - TSV interposer fabrication for 3D IC packaging

Rao, Vempati Srinivasa, Wee, Ho Soon, Vincent, Lee Wen Sheng, Yu, Li Hong, Ebin, Liao, Nagarajan, Ranganathan, Chong, Chai Tai, Zhang, Xiaowu, Damaruganath, Pinjala

Année:

2009

Langue:

english

Fichier:

PDF, 4.66 MB

english, 2009

36

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - Evaluation of support wafer system for thin wafer handling

See Toh Justin, Wai Hong, Chai, Tai Chong, Rao, Vempati Srinivasa, Ho David, Soon Wee, Fernandez, Daniel Moses, Siow, Li Yan, Lee, Wen Sheng, Thew Serene, Meei Ling, Lee, Jaesik

Année:

2010

Langue:

english

Fichier:

PDF, 3.26 MB

english, 2010

37

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Challenges and approaches of ultra-fine pitch Cu pillar assembly on organic substrate using wafer level underfill

Lim, Sharon Pei-Siang, Siow, Li Yan, Chai, Tai Chong, Rao, Vempati Srinivasa, Takeda, Kohei, Enami, Toshio, Koh, Chee Guan, Wang, XiangFeng, Sun, Hong Qi, Ando, Tomoyuki

Année:

2013

Fichier:

PDF, 653 KB

2013

38

[IEEE 2010 12th Electronics Packaging Technology Conference - (EPTC 2010) - Singapore, Singapore (2010.12.8-2010.12.10)] 2010 12th Electronics Packaging Technology Conference - 3D stacking by hybrid bonding with low temperature solder

Paing Myo,, Ser Choong Chong,, Ling Xie,, Soon Wee Ho,, Wai Hong See Toh,, Tai Chong Chai,

Année:

2010

Langue:

english

Fichier:

PDF, 2.30 MB

english, 2010

39

[IEEE 5th Electronics Packaging Technology Conference (EPTC 2003) - Singapore (10-12 Dec. 2003)] Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) - Characterization and property correlation of no-flow underfill for handheld WLP

Wong Wai Kwan,, Kripesh, V., Chai Tai Chong,, Iyer, M.

Année:

2003

Langue:

english

Fichier:

PDF, 343 KB

english, 2003

40

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Study on mold flow during compression molding for embedded wafer level package (EMWLP) with multiple chips

Sorono, D. V., Ji Lin,, Chai Tai Chong,, Ser Choong Chong,, Vempati, S. R.

Année:

2012

Langue:

english

Fichier:

PDF, 847 KB

english, 2012

41

[IEEE 52nd Electronic Components and Technology Conference - San Diego, CA, USA (28-31 May 2002)] 52nd Electronic Components and Technology Conference 2002. (Cat. No.02CH37345) - Application of no-flow underfill for a reliable high performance Flip Chip Flex BGA

Poi-Siong Teo,, Lim, S.P.-S., Tai-Chong Chai,, Iyer, M.K.

Année:

2002

Langue:

english

Fichier:

PDF, 770 KB

english, 2002

42

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Single current source electromigration system and its application to copper pillars with tin based solder

Trigg, Alastair, Chong, Chai Tai, Yao, Hsiao Hsiang, Tzong, Yaw Jyh

Année:

2013

Langue:

english

Fichier:

PDF, 4.61 MB

english, 2013

43

[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Reliability assessment of high density fine pitch lead-free flip chip package

Ser Choong Chong,, Simon Ting,, Tan Yeow Meng,, Chai Tai Chong,, Srinivasamurthy Sampath,, Hnin Wai Yin,, Lim, S., Cheng Chek Kweng,

Année:

2004

Langue:

english

Fichier:

PDF, 309 KB

english, 2004

44

[IEEE 6th Electronics Packaging Technology Conference (EPTC 2004) - Singapore (8-10 Dec. 2004)] Proceedings of 6th Electronics Packaging Technology Conference (EPTC 2004) (IEEE Cat. No.04EX971) - Structural optimization of fine pitch, large die flip chip package

Viswanath, A.G.K., Wang Fang,, Tai-Chong Chai,, Navas Khan,, Sampath, S.

Année:

2004

Langue:

english

Fichier:

PDF, 309 KB

english, 2004

45

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Assembly Challenges of High Density Large Fine Pitch Lead-Free, Flip-Chip Package

Ser Choong Chong,, Yeow Meng Tan,, Tai Chong Chai,, Samuel Lim,, Wai Yin Hnin,, Chek Kweng Cheng,

Année:

2006

Langue:

english

Fichier:

PDF, 2.27 MB

english, 2006

46

[IEEE 2009 11th Electronics Packaging Technology Conference (EPTC) - Singapore, Singapore (2009.12.9-2009.12.11)] 2009 11th Electronics Packaging Technology Conference - Electrochemical migration study of fine pitch lead free micro bump interconnect

Yu, Da-Quan, Chai, Tai Chong, Thew, Meei Ling, Ong, Yue Ying

Année:

2009

Langue:

english

Fichier:

PDF, 1.94 MB

english, 2009

47

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Design & Development of a Large Die and Fine Pitch Wafer-Level Package for Mobile Applications

Kripesh, V., Xiaowu Zhang,, Khan, N., Rotaru, M., Chai Tai Chong,

Année:

2006

Langue:

english

Fichier:

PDF, 752 KB

english, 2006

48

[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Electromigration in Pb-Free Solder Bumps with Cu Column as Flip-Chip Joints

Jae-Woong Nah,, Suh, J.O., Tu, K.N, Seung Wook Yoon,, Chai Tai Chong,, Kripesh, V., Su, B.R, Chih Chen,

Année:

2006

Langue:

english

Fichier:

PDF, 1.18 MB

english, 2006

49

[IEEE 2012 IEEE 14th Electronics Packaging Technology Conference - (EPTC 2012) - Singapore (2012.12.5-2012.12.7)] 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) - Fine pitch solder-less bonding using ultrasonic technique

Ser Choong Chong,, Jie Li Aw,, Cereno, D. I., Li Yan Siow,, Chee Guan Koh,, Witarsa, D., Vempati, S., Tai Chong Chai,

Année:

2012

Langue:

english

Fichier:

PDF, 803 KB

english, 2012

50

[IEEE 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Singapore (2013.12.11-2013.12.13)] 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) - Via-in-Mold (ViM) process for embedded wafer level package (eWLP)

Ho, Soon Wee, Pa Pa, Myo Ei, Fong, Chee Heng, Wang, Zhonghai, Kang, He Tong, Chong, Ser Choong, Chai, Tai Chong

Année:

2013

Langue:

english

Fichier:

PDF, 1.77 MB

english, 2013